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Yield Analysis Engineer

新竹, 臺灣省 or 台灣省, 台灣 职位 ID JR0256197 职位类别 Manufacturing and Process Development 经验级别 Experienced 工时类型 全职
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Job Description


Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and 2 new greenfield sites in Ohio and Germany. As part of Intel's IDM2.0 strategy, FSM is rapidly expanding its operation to deliver output for both internal and foundry customers with state-of-the-art technologies arriving in high-volume manufacturing at a 2-year cadence going forward. Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development team and FSM fab managers.

This job requisition is to seek Yield Analysis engineering roles in FSM HVM Global Yield organization, reporting to YA team manager. Selected candidates will work with other members in Global Yield org including Process Integration, Device and Defect engineering teams, fab module/yield teams and TD team members to achieve yield ramp-up and process optimization in early production stage, supporting internal and external customers.

Yield Analysis Engineers' responsibilities include (but are not limited to):

·Own engineering projects involving large-scale data analysis and machine learning to support HVM yield roadmap, device targeting and attaining performance targets.

·Work with Program Managers, Process Integration, Device and Defect Reduction team members to identify root cause of systematic yield/performance issues and propose mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases.

·Work with Yield Modeling team to develop new yield analysis methods and algorithms to deliver world class yield analytics.

·Formulate yield problems mathematically, identify solutions, and remove technical barriers to achieve successful solutions.

·Provide yield analysis for various engineering projects to improve quality, performance and to reduce wafer cost.

·Engineering support for technical interactions with internal and external customers.

·Work with data scienceteam to establish long-term yield prediction modeling

·Yield debugging at the product develop stage ( NPI yield analysis support )

Candidate should have the following behavioral skills:

·Problem-solving technique with strong self-initiative and self-learning capabilities.

·Ability to work with multi-functional, multi-cultural teams.

·Must demonstrate solid communication skills.


Qualifications


Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Bachelor's degree in science and engineering major.
  • 10+ years' experience in advanced node semiconductor industry in in yield analysis and data science. Level of experience will be considered in determining applicants job grade.
  • 5+ years' Experience in python and other program languages to develop a new analysis method and algorithms using large amount of fab data.
  • 5+ years' experience in big data analysis and machine learning.
  • 5+ years' experience in advanced node semiconductor high-volume manufacturing.
  • 10+ years' experience with Device Physics and overall FinFET process flow.
  • 10+ years’  experience in yield analysis for foundry customers

Preferred Qualifications

  • Advanced degree (Master's or Ph.D.) in science and engineering major.
  • Work experience in TFT environment.
  • Experience in serving external Foundry customers through technical interactions
  • Demonstrated interpersonal skills including influencing, engaging, and motivating.
  • Understanding on GAA (Gate-All-Around) technology architecture.
  • Yield debugging experience in GAA device
  • Experience in new semiconductor technology development.
  • Basic understanding on module processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology.


Inside this Business Group


As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.


Posting Statement


All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.


Position of Trust
This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
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