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Interconnect Architect

希尔斯伯勒, 俄勒冈州, 美国| 鳳凰城, 亞利桑那州, 美国| 佛森, 加利福尼亚州, 美国 职位 ID JR0274010 职位类别 Platform Hardware and Systems Engineering 工作模式 Hybrid 经验级别 Experienced 工时类型 全职
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Job Description


Client Platform Architecture group within Client Computing Group business of Intel Corp. is seeking an experienced interconnect architect to drive the development of next generation of Intel's client off-chip interconnects.

As a Interconnect Architect responsibilities will include but are not limited to::

  • Understand performance, power, cost, user experience, form factor, reuse, and compatibility requirements and tradeoffs of platform off-chip interconnects such as PCI Express, CIO (Converged IO)/USB4/Thunderbolt, MIPI, UCIe and die to die interconnects and/or wireless interconnect.
  • Set short and long term direction for off-chip interconnects and drive realization of said direction throughout path finding as well as product life cycle.
  • Develop partnerships with IP, SoC, Package/Physical design, firmware, PnP, electrical design and validation teams to drive development of IO interconnect technologies and related features.
  • Participate in industry IO standard forms and drive technologies/features that benefit Intel platforms' objectives and business.
  • Document requirements for interconnects in architectural or engineering internal specification documents.

Qualifications


You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Bachelor's of science in Electrical Engineering, Computer Engineering or a related field
  • 8+ years of experience in platform or IO development

Preferred Qualifications:

  • Master's of science in Electrical Engineering, Computer Engineering or a related field
  • Expertise in one or more fundamental electrical and physical design is required: Signal Integrity, Power Integrity, Power Delivery, RFI/EMC, Package, PCB, and/or system design.
  • Experience with standards such as PCIe, MIPI, USB4/Thunderbolt, UCIe, DP/HDMI, or wireless standards is highly desired
  • Comfortable with working in large teams with global team members and stakeholders
  • Excellent verbal and written communication skills
  • Experience driving interconnect technologies from concept to product is highly desired
  • Track record of influencing IO standards is highly desired
  • Familiarity with protocol layer and SoC fabric is an advantage

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.


Inside this Business Group


The Client Computing Group (CCG) is responsible for driving business strategy and product development for Intel's PC products and platforms, spanning form factors such as notebooks, desktops, 2 in 1s, all in ones. Working with our partners across the industry, we intend to deliver purposeful computing experiences that unlock people's potential - allowing each person use our products to focus, create and connect in ways that matter most to them. As the largest business unit at Intel, CCG is investing more heavily in the PC, ramping its capabilities even more aggressively, and designing the PC experience even more deliberately, including delivering a predictable cadence of leadership products. As a result, we are able to fuel innovation across Intel, providing an important source of IP and scale, as well as help the company deliver on its purpose of enriching the lives of every person on earth.

Other Locations



US, AZ, Phoenix; US, CA, Folsom


Posting Statement


All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.



Annual Salary Range for jobs which could be performed in the US $161,230.00-$227,620.00
*Salary range dependent on a number of factors including location and experience


Working Model


This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
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