Packaging Customer Engineer

Job Description

Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.

The IFS Packaging and Test Business Group

Packaging is a critical revenue enabler for IFS and a key part of Intel's forward-looking strategy. IFS Packaging Test Business Group has been created to develop, grow, and execute a robust packaging roadmap.

The primary responsibilities for the Packaging Customer Engineerwill include but are not limited to:

• Collaborate with IFS Customer product design, internal product design, Silicon process development, Intel's Assembly Test Technology Development (ATTD), and Product Engineering teams to drive product architecture definition, product package design and execution.
• Serve as the engineering interface to IFS Customers for packaging services to promote Intel packaging technologies, to perform technical feasibility and risk assessments, to analyze product ask vs. the ATTD packaging roadmap and to close the deal with the customer.
• Drive Customer-facing technology reviews as the key engineering interface between the Customer and Intel Foundry, owning the Customer packaging engineering relationship from product concept through product mass production.
• Work with IFS Business Development, ATTD, ATM and Supply Chain to complete RFQ risk assessments and pricing assessments.
• Capture customer feedback and competitive trends that can better inform the ATTD packaging roadmap.
• Represent the customer in internal technology working groups for new technologies during pathfinding and development.

This position deals with a high level of both technology and market/business ambiguity and future uncertainties. In addition, this person will be frequently interacting and making recommendations to Intel VPs and Corporate VPs and will need to be conversant and knowledgeable in both internal roadmaps and external industry trends.

In this role you will need the following attributes:

• Strong problem solving, analytical, and communication skills.
• Have demonstrated the ability to plan and manage projects.
• Extensive knowledge of Intel packaging development and manufacturing capabilities.
• Experience in ATTD and Competitor packaging roadmaps.
• Experience with product architecture floor plans, IP development cycles, and their dependency on package design and architecture.
• Be able to work independently in a highly matrixed structure with extensive experience presenting to Senior Management (VP and Corporate VP Level).

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Job posting details (such as work model, location, or time type) are subject to change.

Minimum Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science or in a STEM related field of study.
• 9+ years of experience in packaging, with emphasis on Intel's packaging offerings.
• Experience with power delivery, high speed signaling, thermal mechanical analysis, process development, or die disaggregation architectures.
• Experience presenting to external customers/suppliers.

Preferred Qualifications:

• Post Graduate degree in Electrical Engineering, Computer Engineering, Computer Science or in a STEM related field of study.
• Mandarin Fluency is a plus

Inside this Business Group

Intel Foundry is dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. As stewards of Moore's Law, we innovate and foster collaboration within an extensive partner ecosystem to advance technologies and enable our customers to design leadership products. Our strategic investments in geographically diverse manufacturing capacities bolster the resilience of the semiconductor supply chain. Leveraging our technological prowess, expansive manufacturing scale, and a more sustainable supply chain, Intel Foundry empowers the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era. This position is part of the Foundry Services business unit within Intel Foundry, a customer-oriented service organization that is dedicated to the success of its customers with full P&L responsibilities. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.

Other Locations

US, Folsom

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.



Annual Salary Range for jobs which could be performed in the US $186,070.00-$262,680.00
*Salary range dependent on a number of factors including location and experience

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.